According to Nantong Daily, the first batch of equipment of Nantong VietAsia Semiconductor project has been tested and is scheduled to be put into production before the end of June.
It is reported that Nantong VietAsia Semiconductor project is located in Nantong Science and Industry Park, the total investment of the project is about 3.77 billion yuan, the project covers an area of about 141 mu, the total construction area of about 170,000 square meters, officially signed on May 9, 2018, on August 28, 2018, the groundbreaking ceremony was held.
The project is invested and built by Zhuhai Yueya Semiconductor Co., LTD. The project will add about 1,200 sets of internationally leading vacuum splash line, plasma etching and other equipment, and will achieve an annual output of 3.5 million pieces of semiconductor modules, semiconductor devices and packaging substrates.
Data show that Vietasia is a professional engaged in semiconductor module, device, packaging substrate products R & D and production of high-tech enterprises. Yu Xiekang, vice president of China Semiconductor Industry Association, said that through the success of industrialization of its own coreless packaging substrate technology, Yue Ya broke the monopoly market situation of foreign high-end IC packaging substrate manufacturers, and promoted the breakthrough of China's IC industry from "made in China" to "created in China" in the field of packaging substrate.
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Source URL:https://mp.weixin.qq.com/s/pR824gqWKr3fKOsQVNQcMw