Industry | ACCESS: From packaging substrate to semiconductor Zhuhai ACCESS's upgrade road

Date: 2018-04-13　Click: 1857　Source: [Today's Doumen]

Speaking of semiconductors, I believe most people will feel strange and familiar. A semiconductor is actually a material whose electrical conductivity can be controlled, ranging from an insulator to a conductor.

No matter from the point of view of science and technology progress and economic development, the importance of semiconductor has a very large, but in today's life most electronic products, such as computers, mobile phones, TV, digital recorder and many other core unit of the electronic products, and semiconductor has very close relation, it is connected with people's lives, affecting the progress of The Times.

We will pursue innovative development despite wind and rain

When you enter the office area of VietAsia, the first thing you see is a whole patent wall. They are like bright achievements, recording the achievements and crystallization of VietAsia in the past few years, and recording the trials and hardships behind each honor.

"Vietasia has been working on packaging substrates for 13 years. Due to the low self-sufficiency rate of the entire Chinese semiconductor industry, VietAsia occupies a very small share of the global market. Therefore, although VietAsia has unique technological advantages, it has not made any breakthrough in the past 10 years due to the overall market environment." General manager Chen Xianming said the development course of the more Asia.

In 2006, Zhuhai Yueya Packaging Substrate Technology Co., Ltd. was established in Zhuhai. It was originally a joint venture between Chinese and Israeli enterprises, focusing on the industrialization of invention patents of high-end organic coreless packaging substrate. After several years of technical cultivation, it began to formally mass produce in early 2010.

Over the years, the more the through constant innovation and development, become the world's first use "copper column method" production of high density coreless packaging substrate, and implement the production of innovative enterprise, is a national high-tech enterprises, private technology enterprises in guangdong province and zhuhai enterprises intellectual property advantage, and is equipped with engineering technology center of guangdong province.

On July 31, 2012, Zhuhai Yueya Packaging Substrate Technology Co., Ltd. was officially renamed as Zhuhai Yueya Packaging Substrate Technology Co., LTD.

It seems that we are moving forward all the way, but in fact, the road of development is not smooth. At the beginning of the establishment of Vietnam Asia, part of the management, including the CEO at the time, are from Israel. Cultural differences and inaccurate development strategy formulation lead to the loss of big customers.

"At that time, people did not have much confidence in the status of VietAsia. It was not until the new CEO, Mr. Chen Xianming, took office that the situation was turned around, and the product categories were increased in a short period of time, the customer base was opened, and the VietAsia gradually appeared a new turnaround." Vietasia Chief Financial Officer Chen Chunling introduced.

"As a technology driven industries, to occupy the leading position, we must do it step by step ahead, the more the did globalization in terms of talent introduction of talent, and greatly increased the research and development investment, make more in recent years has dominated the industry leading position, realized the enterprise innovation and development on the basis of original."

Capacity expansion to achieve self-sufficiency

Chen Chunling introduced that from 2017 to 2018, the packaging substrate produced by domestic factories in China only accounted for 2% of the world's output, among which, Vietnam Asia accounted for 1%, undoubtedly the leading position, but because the domestic total in the world is still too little, so the total production capacity of Vietnam Asia has not reached the ideal state

In 2017, the total value of China's integrated circuit import was 260 billion yuan, surpassing petroleum as the single largest import product. If the self-sufficiency of integrated circuit can be realized, it will undoubtedly bring a subversive change to the entire semiconductor industry.

Therefore, Vietnam realized that the real economy's revitalization and development can achieve a breakthrough, the proportion of production capacity and market share, played a decisive role.

In view of this situation, general manager Chen Xianming introduced the future of the enterprise planning, as well as the blueprint for the future of the industry.

"In accordance with the national macroscopic industry plan, its self-sufficiency rate of semiconductor in China in 2022, will increase from the current 10% to 70%, which means that the state of the semiconductor industry will get vigorous development, the semiconductor industry, ecological chain, including IC design, wafer fabrication, packaging substrates, encapsulation testing and original device will get benefits

From the perspective of micro strategy, the three subdivision applications, namely RF chip, power module and special purpose chip, which VietAsia has always occupied the industry monopoly position and technological superiority position, will achieve rapid development in the next few years.

In 2019, the 5G market will be commercialized, which requires our RF chips to make breakthroughs in innovation on the original advantages.

The power management module is bound to expand its capacity due to the rapid development of wearable product shipments. Currently, the global shipment of wearable products is 5 billion, and it will reach 30 billion by 2022. This is a rapidly growing market, and we must keep pace with this pace. Affected by the rapid development of artificial intelligence, special-purpose chips are constantly upgrading their technology.

Holds a technological advantage position in the three areas, the more the breakthrough will along with the development of the application itself and rapid development, from the macro and micro perspective, the more the faces a broad market, at present the first thing to do is to expand capacity, from $100 million in annual sales, fast growth to $600 million. The NEXT STEP IS TO EXPAND THE LARGER PACKAGING SUBSTRATE TO THE RELEVANT UNITS, AND FINALLY MOVE BEYOND THE PACKAGING SUBSTRATE TO ACHIEVE A BREAKTHROUGH IN INDUSTRY-WIDE INTEGRATED WAFER DESIGN."

In recent years, Yueya has been equipped with the world's leading "copper pillar method" cored packaging substrate technology and precision process, which can maximize meet the needs of today's advanced packaging design with high density, high efficiency, low energy consumption and high speed. Vietnam Asia's core technology has obtained more than 70 authorized invention patents in China, the United States, South Korea, Israel and other countries, and has more than 180 international patents.

The coreless packaging substrate of its own technology industrialization of success, but also broke the foreign high-end IC package substrate manufacturers monopoly situation of the market, its use in the product manufacturing process makes the company produces the coreless packaging substrate with originality and sex within the industry, is China's integrated circuit industry in the field of packaging substrate from "made in China" to "created in China".

However, these in the eyes of Chen Xianming, but still not enough to adapt to the future intelligent age, he said Vietnam Asia will continue to implement technological breakthroughs, to create more lead.

"Maybe one day you'll get a full power management chip from VietAsia." Chen Xianming said proudly.

Source URL：https://mp.weixin.qq.com/s/qg0aPT6_w-QRB5keBB0hcg